The afternoon of August 29th, Anhui Dahua Semiconductor Technology Co. Ltd. (hereinafter referred to as "Dahua Technology") released 180 tons of automatic packaging system independent R & D and production, and the scene with Hefei Tong Fu Microelectronics Co. Ltd. (hereinafter referred to as "Hefei rich") held a ceremony to sign products. This is a cooperative practice on the industrial chain of "Hefei made" and "Hefei".

Dahua science and technology over the past two years of grinding, key technologies to focus on the key. Optimize the design of the mechanical structure, the resin column and drive action is more stable and efficient; driven by high precision servo control, mold and injection action position and velocity accurately, through the use of large bore punching cylinder, and the use of new booster pumps to increase supply, product flow to the punching force of larger, more action stable, higher quality products. The company has also developed a micro pneumatic clip claw to achieve accurate operation of the material and material, and the action is faster and more efficient. The successful signing of Dahua Technology and Hefei Tongfu is a sign that the product has been successfully certified and approved by the market. At the same time, the successful offline sale of the automatic packaging system has also broken the gap of our province's integrated circuit high-end packaging equipment, which is of great significance for improving and strengthening the industrial chain of Hefei.

The conference was co sponsored by Anhui Dahua Semiconductor Technology Co., Ltd., Hefei semiconductor industry association and Hefei integrated circuit industry technology innovation strategy alliance. The Provincial Committee of the Commission, the municipal development and Reform Commission, the Municipal Science and Technology Bureau and other related leaders have witnessed the release of the products. Industrial chain representatives from Tongfu, Guo Jing, Si Mai and Xin Fu participated in the conference.

Dahua science and technology, founded in June 2014, is a company specializing in the research and development of semiconductor integrated circuit packaging and testing equipment and mold products. The company has a total investment of 35 million yuan in the early stage, and a complete mold processing and testing production line has been established. The production process conditions are up to the advanced level in China.